Wire bond failures in power modules

S. Ramminger; G. Wachutka

doi:10.1115/IMECE2003-42233

Wire bond failures in power modules

S. Ramminger, G. Wachutka

Computation, Information and Technology

Siemens AG

Research output: Contribution to conference › Paper › peer-review

2 Scopus citations

Abstract

Power modules are key components for traction applications, railway locomotives, streetcars and elevators, all of which are equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this application field, a highly reliable system is of uppermost interest. Reliability tests show that wire bonding and soldering may cause the modules to fail. The packaging setup is a multilayer system in which different materials are soldered together. During a temperature swing caused by self-heating and/or by changes in the ambient temperature, the layers expand differently. This generally causes shear forces at the terminations of joint interfaces finally leading to material fatigue and shorter life. In this paper, we give an overview of the wire bonding technique used in power modules and discuss the mechanisms and failure modes associated with it.

Original language	English
Pages	267-274
Number of pages	8
DOIs	https://doi.org/10.1115/IMECE2003-42233
State	Published - 2003
Event	2003 ASME International Mechanical Engineering Congress - Washington, DC, United States Duration: 15 Nov 2003 → 21 Nov 2003

Conference

Conference	2003 ASME International Mechanical Engineering Congress
Country/Territory	United States
City	Washington, DC
Period	15/11/03 → 21/11/03

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10.1115/IMECE2003-42233

Cite this

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title = "Wire bond failures in power modules",

abstract = "Power modules are key components for traction applications, railway locomotives, streetcars and elevators, all of which are equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this application field, a highly reliable system is of uppermost interest. Reliability tests show that wire bonding and soldering may cause the modules to fail. The packaging setup is a multilayer system in which different materials are soldered together. During a temperature swing caused by self-heating and/or by changes in the ambient temperature, the layers expand differently. This generally causes shear forces at the terminations of joint interfaces finally leading to material fatigue and shorter life. In this paper, we give an overview of the wire bonding technique used in power modules and discuss the mechanisms and failure modes associated with it.",

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AB - Power modules are key components for traction applications, railway locomotives, streetcars and elevators, all of which are equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this application field, a highly reliable system is of uppermost interest. Reliability tests show that wire bonding and soldering may cause the modules to fail. The packaging setup is a multilayer system in which different materials are soldered together. During a temperature swing caused by self-heating and/or by changes in the ambient temperature, the layers expand differently. This generally causes shear forces at the terminations of joint interfaces finally leading to material fatigue and shorter life. In this paper, we give an overview of the wire bonding technique used in power modules and discuss the mechanisms and failure modes associated with it.

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T2 - 2003 ASME International Mechanical Engineering Congress

Y2 - 15 November 2003 through 21 November 2003

ER -

Wire bond failures in power modules

Abstract

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