Wafer Map Defect Classification Based on the Fusion of Pattern and Pixel Information

Yiwen Liao, Raphael Latty, Paul R. Genssler, Hussam Amrouch, Bin Yang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

With the dramatically increasing requirements on semiconductor products, improving the yield is one of the major tasks for semiconductor manufacturers. To minimize losses, automatic and efficient wafer testing tools are required to quickly notify the engineers of potential problems. One such technique is wafer map defect pattern classification, which has inspired and motivated extensive research over the last decades. Many popular studies often design novel wafer map defect identification algorithms based on manual feature extraction, statistical learning and deep neural networks, having achieved significant advancement and success. However, these methods often face challenges of training large-scale networks and few of them have noticed the full usage of the information within each wafer map. Based on the concerns above, this paper proposes a multi-task learning framework based on neural networks that fuses the information of the entire wafer map as well as the state of each individual die to enhance the defect pattern classification capability. Extensive experiments on a public real-world dataset have been conducted to justify the effectiveness of our method. Specifically, our method achieved an classification accuracy of 96.3%, which was better or comparable to other state-of-the-art approaches that required notably larger network sizes and heavy data augmentation.

Original languageEnglish
Title of host publicationProceedings - 2022 IEEE International Test Conference, ITC 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-9
Number of pages9
ISBN (Electronic)9781665462709
DOIs
StatePublished - 2022
Externally publishedYes
Event2022 IEEE International Test Conference, ITC 2022 - Anaheim, United States
Duration: 23 Sep 202230 Sep 2022

Publication series

NameProceedings - International Test Conference
Volume2022-September
ISSN (Print)1089-3539

Conference

Conference2022 IEEE International Test Conference, ITC 2022
Country/TerritoryUnited States
CityAnaheim
Period23/09/2230/09/22

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