Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

Yun Wang; Stevan S. Djordjecvic; Jin Yao; John E. Cunningham; Xuezhe Zheng; Ashok V. Krishnamoorthy; Michael Muller; Markus Christian Amann; Richard Bojko; Nicolas A.F. Jaeger; Lukas Chrostowski

doi:10.1109/OIC.2015.7115716

Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

Yun Wang
, Stevan S. Djordjecvic
, Jin Yao
, John E. Cunningham
, Xuezhe Zheng
, Ashok V. Krishnamoorthy
, Michael Muller
, Markus Christian Amann
, Richard Bojko
, Nicolas A.F. Jaeger
, Lukas Chrostowski

Chair of Semiconductor Technology

University of British Columbia
Oracle America, Inc.
Walter Schottky Institut
University of Washington

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

17 Scopus citations

Abstract

We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.

Original language	English
Title of host publication	2015 IEEE Optical Interconnects Conference, OI 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	122-123
Number of pages	2
ISBN (Electronic)	9781479981793
DOIs	https://doi.org/10.1109/OIC.2015.7115716
State	Published - 29 May 2015
Event	2015 IEEE Optical Interconnects Conference, OI 2015 - San Diego, United States Duration: 20 Apr 2015 → 22 Apr 2015

Publication series

Name	2015 IEEE Optical Interconnects Conference, OI 2015

Conference

Conference	2015 IEEE Optical Interconnects Conference, OI 2015
Country/Territory	United States
City	San Diego
Period	20/04/15 → 22/04/15

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10.1109/OIC.2015.7115716

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Wang, Y., Djordjecvic, S. S., Yao, J., Cunningham, J. E., Zheng, X., Krishnamoorthy, A. V., Muller, M., Amann, M. C., Bojko, R., Jaeger, N. A. F., & Chrostowski, L. (2015). Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip. In 2015 IEEE Optical Interconnects Conference, OI 2015 (pp. 122-123). Article 7115716 (2015 IEEE Optical Interconnects Conference, OI 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/OIC.2015.7115716

@inproceedings{e62ed888a1414e349ddc88ea328249ec,

title = "Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip",

abstract = "We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.",

author = "Yun Wang and Djordjecvic, \{Stevan S.\} and Jin Yao and Cunningham, \{John E.\} and Xuezhe Zheng and Krishnamoorthy, \{Ashok V.\} and Michael Muller and Amann, \{Markus Christian\} and Richard Bojko and Jaeger, \{Nicolas A.F.\} and Lukas Chrostowski",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 2015 IEEE Optical Interconnects Conference, OI 2015 ; Conference date: 20-04-2015 Through 22-04-2015",

year = "2015",

month = may,

day = "29",

doi = "10.1109/OIC.2015.7115716",

language = "English",

series = "2015 IEEE Optical Interconnects Conference, OI 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "122--123",

booktitle = "2015 IEEE Optical Interconnects Conference, OI 2015",

}

Wang, Y, Djordjecvic, SS, Yao, J, Cunningham, JE, Zheng, X, Krishnamoorthy, AV, Muller, M, Amann, MC, Bojko, R, Jaeger, NAF & Chrostowski, L 2015, Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip. in 2015 IEEE Optical Interconnects Conference, OI 2015., 7115716, 2015 IEEE Optical Interconnects Conference, OI 2015, Institute of Electrical and Electronics Engineers Inc., pp. 122-123, 2015 IEEE Optical Interconnects Conference, OI 2015, San Diego, United States, 20/04/15. https://doi.org/10.1109/OIC.2015.7115716

Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip. / Wang, Yun; Djordjecvic, Stevan S.; Yao, Jin et al.
2015 IEEE Optical Interconnects Conference, OI 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 122-123 7115716 (2015 IEEE Optical Interconnects Conference, OI 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

AU - Wang, Yun

AU - Djordjecvic, Stevan S.

AU - Yao, Jin

AU - Cunningham, John E.

AU - Zheng, Xuezhe

AU - Krishnamoorthy, Ashok V.

AU - Muller, Michael

AU - Amann, Markus Christian

AU - Bojko, Richard

AU - Jaeger, Nicolas A.F.

AU - Chrostowski, Lukas

PY - 2015/5/29

Y1 - 2015/5/29

N2 - We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.

AB - We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.

UR - https://www.scopus.com/pages/publications/84936930931

U2 - 10.1109/OIC.2015.7115716

DO - 10.1109/OIC.2015.7115716

M3 - Conference contribution

AN - SCOPUS:84936930931

T3 - 2015 IEEE Optical Interconnects Conference, OI 2015

SP - 122

EP - 123

BT - 2015 IEEE Optical Interconnects Conference, OI 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2015 IEEE Optical Interconnects Conference, OI 2015

Y2 - 20 April 2015 through 22 April 2015

ER -

Wang Y, Djordjecvic SS, Yao J, Cunningham JE, Zheng X, Krishnamoorthy AV et al. Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip. In 2015 IEEE Optical Interconnects Conference, OI 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 122-123. 7115716. (2015 IEEE Optical Interconnects Conference, OI 2015). doi: 10.1109/OIC.2015.7115716

Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

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