Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

Yun Wang, Stevan S. Djordjecvic, Jin Yao, John E. Cunningham, Xuezhe Zheng, Ashok V. Krishnamoorthy, Michael Muller, Markus Christian Amann, Richard Bojko, Nicolas A.F. Jaeger, Lukas Chrostowski

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

16 Scopus citations

Abstract

We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.

Original languageEnglish
Title of host publication2015 IEEE Optical Interconnects Conference, OI 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages122-123
Number of pages2
ISBN (Electronic)9781479981793
DOIs
StatePublished - 29 May 2015
Event2015 IEEE Optical Interconnects Conference, OI 2015 - San Diego, United States
Duration: 20 Apr 201522 Apr 2015

Publication series

Name2015 IEEE Optical Interconnects Conference, OI 2015

Conference

Conference2015 IEEE Optical Interconnects Conference, OI 2015
Country/TerritoryUnited States
CitySan Diego
Period20/04/1522/04/15

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