TY - GEN
T1 - VERHALTEN VON LOETVERBINDUNGEN UNTER THERMISCHER UND MECHANISCHER BEANSPRUCHUNG.
AU - Schmitt-Thomas, Kh G.
AU - Wege, S.
PY - 1986
Y1 - 1986
N2 - If soldered joints were set out to thermal and mechanical stresses, appearance of fatigue can be observed. For soldered joints on printed boards, temperature-cycle and vibration-researches were performed. The different solders were Sn60Pb, Sn62Pb35Ag2 and Sn43Bi. Also different devices (resistors in printed circuit through holes, chip-resistors and flatpacks) were used. After different cycles of stresses the change of the solder surface, the fracture in the soldered joints and the growth of the intermetallic zone were observed.
AB - If soldered joints were set out to thermal and mechanical stresses, appearance of fatigue can be observed. For soldered joints on printed boards, temperature-cycle and vibration-researches were performed. The different solders were Sn60Pb, Sn62Pb35Ag2 and Sn43Bi. Also different devices (resistors in printed circuit through holes, chip-resistors and flatpacks) were used. After different cycles of stresses the change of the solder surface, the fracture in the soldered joints and the growth of the intermetallic zone were observed.
UR - https://www.scopus.com/pages/publications/0022906371
M3 - Konferenzbeitrag
AN - SCOPUS:0022906371
SN - 3871554073
T3 - DVS Berichte (Deutscher Verband fuer Schweisstechnik)
SP - 133
EP - 136
BT - DVS Berichte (Deutscher Verband fuer Schweisstechnik)
PB - Deutscher Verlag fuer Schweisstechnik GmbH
ER -