VERHALTEN VON LOETVERBINDUNGEN UNTER THERMISCHER UND MECHANISCHER BEANSPRUCHUNG.

Translated title of the contribution: The Behaviour of Soldered Joints under Thermal and Mechanical Stresses.

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

If soldered joints were set out to thermal and mechanical stresses, appearance of fatigue can be observed. For soldered joints on printed boards, temperature-cycle and vibration-researches were performed. The different solders were Sn60Pb, Sn62Pb35Ag2 and Sn43Bi. Also different devices (resistors in printed circuit through holes, chip-resistors and flatpacks) were used. After different cycles of stresses the change of the solder surface, the fracture in the soldered joints and the growth of the intermetallic zone were observed.

Translated title of the contributionThe Behaviour of Soldered Joints under Thermal and Mechanical Stresses.
Original languageGerman
Title of host publicationDVS Berichte (Deutscher Verband fuer Schweisstechnik)
PublisherDeutscher Verlag fuer Schweisstechnik GmbH
Pages133-136
Number of pages4
ISBN (Print)3871554073
StatePublished - 1986

Publication series

NameDVS Berichte (Deutscher Verband fuer Schweisstechnik)
Volume102
ISSN (Print)0418-9639

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