Transient analysis of latent damage formation in SMD capacitors by Transmission Line Pulsing (TLP)

D. Helmut, G. Wachutka, G. Groos

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Latent defects were provoked in SMD capacitors by short TLP current pulses. Simultaneously the transient evolution of the device's charge was extracted to generate its Q(V) characteristics and to determine its capacitive behaviour during the transient current stress. We could alter the capacitors so that normal operation was influenced only slightly, but the dielectric breakdown behaviour was considerably changed, which would result in an endangered application. The proposed method can generate and analyse those latent defects simultaneously.

Original languageEnglish
Pages (from-to)97-101
Number of pages5
JournalMicroelectronics Reliability
Volume76-77
DOIs
StatePublished - Sep 2017

Keywords

  • Defect generation
  • Dielectric breakdown
  • EOS
  • Electrical overstress
  • Latent defects
  • Latent failure
  • SMD capacitors
  • TLP
  • Transient characterisation
  • Transmission line pulsing

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