TY - GEN
T1 - Towards predictive system-level modelling of miniaturized photoacoustic gas sensors
AU - Essing, Simon
AU - Schrag, Gabriele
AU - Tumpold, David
AU - Glacer, Christoph
AU - Mihotek, Michael
AU - Kravchenko, Andrey
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - We present a novel modeling approach that integrates the sub-models of the different physical domains of a PAS sensor. In this way, a connected system-level-model is created considering the optical power of the infrared source, the transmissivity of the optical filter, the absorption behavior of a target gas, and the sensitivity of the microphone used. Based on this model, the influence of the individual components on the overall system is determined in order to identify possible candidates as target gases for miniaturized PAS systems.
AB - We present a novel modeling approach that integrates the sub-models of the different physical domains of a PAS sensor. In this way, a connected system-level-model is created considering the optical power of the infrared source, the transmissivity of the optical filter, the absorption behavior of a target gas, and the sensitivity of the microphone used. Based on this model, the influence of the individual components on the overall system is determined in order to identify possible candidates as target gases for miniaturized PAS systems.
UR - http://www.scopus.com/inward/record.url?scp=85129475088&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE54907.2022.9758881
DO - 10.1109/EuroSimE54907.2022.9758881
M3 - Conference contribution
AN - SCOPUS:85129475088
T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Y2 - 25 April 2022 through 27 April 2022
ER -