TY - GEN
T1 - Towards high fidelity silicon microphones
T2 - 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
AU - Schrag, G.
AU - Kunzig, T.
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/5/10
Y1 - 2017/5/10
N2 - The benefits of a modular, tailored system-level modeling approach, which combines lumped with distributed models, are demonstrated for an industrial capacitive silicon microphone. The performance of such microphones is determined by distributed effects like viscous damping and inhomogeneous capacitance variation across the membrane as well as by system-level phenomena like package-induced acoustic effects and the impact of the electronic circuitry for biasing and read-out. The proposed modeling approach provides maximum insight into the device and system operation while keeping the computational expense low. All relevant figures of merit are covered by the presented model. Hence it enables to evaluate the potential of optimizing silicon microphones towards high fidelity applications.
AB - The benefits of a modular, tailored system-level modeling approach, which combines lumped with distributed models, are demonstrated for an industrial capacitive silicon microphone. The performance of such microphones is determined by distributed effects like viscous damping and inhomogeneous capacitance variation across the membrane as well as by system-level phenomena like package-induced acoustic effects and the impact of the electronic circuitry for biasing and read-out. The proposed modeling approach provides maximum insight into the device and system operation while keeping the computational expense low. All relevant figures of merit are covered by the presented model. Hence it enables to evaluate the potential of optimizing silicon microphones towards high fidelity applications.
UR - http://www.scopus.com/inward/record.url?scp=85020228981&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2017.7926291
DO - 10.1109/EuroSimE.2017.7926291
M3 - Conference contribution
AN - SCOPUS:85020228981
T3 - 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
BT - 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 3 April 2017 through 5 April 2017
ER -