TLM modeling of planar microwave circuits

B. Isele; M. Aidam; P. Russer

doi:10.1109/EUMA.1996.337609

TLM modeling of planar microwave circuits

B. Isele
, M. Aidam
, P. Russer

Technical University of Munich

Technical University of Munich

Research output: Contribution to conference › Paper › peer-review

Abstract

The Transmission Line Matrix (TLM) method [1] is applied to the analysis of planar circuits for monolithic microwave integrated circuits (MMICs). The high-density packaging of these circuits demands full-wave analysis. Recently, efforts have been made to improve the accuracy and efficiency of the TLM schemes based on symmetrical condensed nodes [2]. The modeling of planar circuits containing thin metallic boundaries and three-dimensional discontinuities require TLM meshes with large numbers of nodes. In order to cover the simulation in reasonable computing time additional models have to be incorporated into a general purpose TLM field solver. We investigate several coplanar structures emphasizing the advantages of TLM method.

Original language	English
Pages	444-446
Number of pages	3
DOIs	https://doi.org/10.1109/EUMA.1996.337609
State	Published - 1996
Event	1996 26th European Microwave Conference, EuMC 1996 - Prague, Czech Republic Duration: 6 Sep 1996 → 13 Sep 1996

Conference

Conference	1996 26th European Microwave Conference, EuMC 1996
Country/Territory	Czech Republic
City	Prague
Period	6/09/96 → 13/09/96

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10.1109/EUMA.1996.337609

Cite this

@conference{04a6ef62a406487b9867290bd71815df,

title = "TLM modeling of planar microwave circuits",

abstract = "The Transmission Line Matrix (TLM) method [1] is applied to the analysis of planar circuits for monolithic microwave integrated circuits (MMICs). The high-density packaging of these circuits demands full-wave analysis. Recently, efforts have been made to improve the accuracy and efficiency of the TLM schemes based on symmetrical condensed nodes [2]. The modeling of planar circuits containing thin metallic boundaries and three-dimensional discontinuities require TLM meshes with large numbers of nodes. In order to cover the simulation in reasonable computing time additional models have to be incorporated into a general purpose TLM field solver. We investigate several coplanar structures emphasizing the advantages of TLM method.",

author = "B. Isele and M. Aidam and P. Russer",

year = "1996",

doi = "10.1109/EUMA.1996.337609",

language = "English",

pages = "444--446",

note = "1996 26th European Microwave Conference, EuMC 1996 ; Conference date: 06-09-1996 Through 13-09-1996",

}

TY - CONF

T1 - TLM modeling of planar microwave circuits

AU - Isele, B.

AU - Aidam, M.

AU - Russer, P.

PY - 1996

Y1 - 1996

N2 - The Transmission Line Matrix (TLM) method [1] is applied to the analysis of planar circuits for monolithic microwave integrated circuits (MMICs). The high-density packaging of these circuits demands full-wave analysis. Recently, efforts have been made to improve the accuracy and efficiency of the TLM schemes based on symmetrical condensed nodes [2]. The modeling of planar circuits containing thin metallic boundaries and three-dimensional discontinuities require TLM meshes with large numbers of nodes. In order to cover the simulation in reasonable computing time additional models have to be incorporated into a general purpose TLM field solver. We investigate several coplanar structures emphasizing the advantages of TLM method.

AB - The Transmission Line Matrix (TLM) method [1] is applied to the analysis of planar circuits for monolithic microwave integrated circuits (MMICs). The high-density packaging of these circuits demands full-wave analysis. Recently, efforts have been made to improve the accuracy and efficiency of the TLM schemes based on symmetrical condensed nodes [2]. The modeling of planar circuits containing thin metallic boundaries and three-dimensional discontinuities require TLM meshes with large numbers of nodes. In order to cover the simulation in reasonable computing time additional models have to be incorporated into a general purpose TLM field solver. We investigate several coplanar structures emphasizing the advantages of TLM method.

UR - https://www.scopus.com/pages/publications/84897517025

U2 - 10.1109/EUMA.1996.337609

DO - 10.1109/EUMA.1996.337609

M3 - Paper

AN - SCOPUS:84897517025

SP - 444

EP - 446

T2 - 1996 26th European Microwave Conference, EuMC 1996

Y2 - 6 September 1996 through 13 September 1996

ER -

TLM modeling of planar microwave circuits

Abstract

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