Thermal stability of wood-wood and Wood-FRP bonding with polyurethane and epoxy adhesives

Klaus Richter, René Steiger

Research output: Contribution to journalArticlepeer-review

52 Scopus citations

Abstract

The temperature-dependent creep of different polyurethane (PUR) and epoxy (EP) adhesives was investigated in relation to glue line thickness. A water-based hydroxymethylated resorcinol coupling agent was developed which improves the delaminating resistance of PUR and EP adhesives. The results show that crosslinked polymers of PUR and EP adhesives display significant viscoelastic responses over temperature ranges that are relevant for practical applications. Thus, temperature-dependent creep is a risk factor that needs to be considered for structural applications.

Original languageEnglish
Pages (from-to)419-426
Number of pages8
JournalAdvanced Engineering Materials
Volume7
Issue number5
DOIs
StatePublished - May 2005
Externally publishedYes

Fingerprint

Dive into the research topics of 'Thermal stability of wood-wood and Wood-FRP bonding with polyurethane and epoxy adhesives'. Together they form a unique fingerprint.

Cite this