@inproceedings{bb1615bd57c2441f8638f91728a16c4d,
title = "Thermal modeling and measurement of a power amplifier module for a silicon-ceramic substrate",
abstract = "In the present paper, the thermal behavior of a power amplifier on a printed circuit board (PCB) and in a low-temperature co-fired ceramics module is examined by thermal FE modelling and measurements on the PCB module. The thermal impact on the performance of the PA and its power dissipation are determined by harmonic balance simulation and measurements. Based on these simulations, an integrated design of a demonstrator system on SiCer is pursued.",
keywords = "FE simulation, Power Amplifier, thermal measurement, thermal modeling",
author = "A. Frank and Cortes, {V. Silva} and Steffen Michael and A. Hagelauer and G. Fischer",
note = "Publisher Copyright: {\textcopyright} 2018 IMA.; 11th German Microwave Conference, GeMiC 2018 ; Conference date: 12-03-2018 Through 14-03-2018",
year = "2018",
month = apr,
day = "10",
doi = "10.23919/GEMIC.2018.8335033",
language = "English",
series = "GeMiC 2018 - 2018 German Microwave Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "79--82",
booktitle = "GeMiC 2018 - 2018 German Microwave Conference",
}