Thermal modeling and measurement of a power amplifier module for a silicon-ceramic substrate

A. Frank, V. Silva Cortes, Steffen Michael, A. Hagelauer, G. Fischer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

In the present paper, the thermal behavior of a power amplifier on a printed circuit board (PCB) and in a low-temperature co-fired ceramics module is examined by thermal FE modelling and measurements on the PCB module. The thermal impact on the performance of the PA and its power dissipation are determined by harmonic balance simulation and measurements. Based on these simulations, an integrated design of a demonstrator system on SiCer is pursued.

Original languageEnglish
Title of host publicationGeMiC 2018 - 2018 German Microwave Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages79-82
Number of pages4
ISBN (Electronic)9783981266887
DOIs
StatePublished - 10 Apr 2018
Externally publishedYes
Event11th German Microwave Conference, GeMiC 2018 - Freiburg, Germany
Duration: 12 Mar 201814 Mar 2018

Publication series

NameGeMiC 2018 - 2018 German Microwave Conference
Volume2018-January

Conference

Conference11th German Microwave Conference, GeMiC 2018
Country/TerritoryGermany
CityFreiburg
Period12/03/1814/03/18

Keywords

  • FE simulation
  • Power Amplifier
  • thermal measurement
  • thermal modeling

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