Thermal management for dependable on-chip systems

Jörg Henkel, Thomas Ebi, Hussam Amrouch, Heba Khdr

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

23 Scopus citations

Abstract

Dependability has become a growing concern in the nano-CMOS era due to elevated temperatures and an increased susceptibility to temperature of the small structures. We present an overview of temperature-related effects that threaten dependability and a methodology for reducing the dependability concerns through thermal management utilizing the concept of aging budgeting.

Original languageEnglish
Title of host publication2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Pages113-118
Number of pages6
DOIs
StatePublished - 2013
Externally publishedYes
Event2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 - Yokohama, Japan
Duration: 22 Jan 201325 Jan 2013

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Country/TerritoryJapan
CityYokohama
Period22/01/1325/01/13

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