TY - GEN
T1 - Theoretical and experimental investigations on failure mechanisms occuring during long-term cycling of electrostatic actuators
AU - Behlert, R.
AU - Künzig, T.
AU - Schrag, G.
AU - Wachutka, G.
PY - 2014
Y1 - 2014
N2 - We present an extensive study on dielectric charging effects, one of the major problems that limit the reliability of electrostatically actuated microdevices (such as the RF MEMS switches considered here) and, thus, their way into a broad commercial application. For the first time, we are able to provide quantitative statements on the amount of charge injected into the dielectric layers. They result from monitoring the long-term evolution of the switching voltages of the DUT recorded by a novel, on-purpose developed measurement setup, which enables also temperature-dependent investigations. Furthermore, the origin of the parasitic charges, their impact on the switching operation and measures to remove them from the dielectric layers could be identified.
AB - We present an extensive study on dielectric charging effects, one of the major problems that limit the reliability of electrostatically actuated microdevices (such as the RF MEMS switches considered here) and, thus, their way into a broad commercial application. For the first time, we are able to provide quantitative statements on the amount of charge injected into the dielectric layers. They result from monitoring the long-term evolution of the switching voltages of the DUT recorded by a novel, on-purpose developed measurement setup, which enables also temperature-dependent investigations. Furthermore, the origin of the parasitic charges, their impact on the switching operation and measures to remove them from the dielectric layers could be identified.
UR - http://www.scopus.com/inward/record.url?scp=84901422853&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2014.6813822
DO - 10.1109/EuroSimE.2014.6813822
M3 - Conference contribution
AN - SCOPUS:84901422853
SN - 9781479947904
T3 - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
BT - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
PB - IEEE Computer Society
T2 - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
Y2 - 7 April 2014 through 9 April 2014
ER -