TY - GEN
T1 - The thermodynamic model as common base for modeling integrated microsensors and smart electronic devices
AU - Wachutka, Gerhard
N1 - Publisher Copyright:
© 1992 IEEE.
PY - 1992
Y1 - 1992
N2 - A systematic approach towards problem-oriented modeling of integrated systems of mi-crosensors and actuators and smart electronic devices is presented. The use of a universal description of microsystems on the base of phenomenological irreversible thermodynamics allows to deduce "tailored" model equations for each individual system component and, moreover, for assembling the constituent components in a self-consistent and physically proper way. By our methodology a well-structured partition of the system simulation problem is achieved, suggesting the application of domain decomposition and parallelization techniques. Since all physical parameter models (transport coefficients, equations of state etc.) may be interpreted in terms of phenomenological (i.e., measurable) quantities, tailored modeling strongly benefits from the availability of a process-oriented material-property data base.
AB - A systematic approach towards problem-oriented modeling of integrated systems of mi-crosensors and actuators and smart electronic devices is presented. The use of a universal description of microsystems on the base of phenomenological irreversible thermodynamics allows to deduce "tailored" model equations for each individual system component and, moreover, for assembling the constituent components in a self-consistent and physically proper way. By our methodology a well-structured partition of the system simulation problem is achieved, suggesting the application of domain decomposition and parallelization techniques. Since all physical parameter models (transport coefficients, equations of state etc.) may be interpreted in terms of phenomenological (i.e., measurable) quantities, tailored modeling strongly benefits from the availability of a process-oriented material-property data base.
UR - http://www.scopus.com/inward/record.url?scp=85073890794&partnerID=8YFLogxK
U2 - 10.1109/NUPAD.1992.673849
DO - 10.1109/NUPAD.1992.673849
M3 - Conference contribution
AN - SCOPUS:85073890794
T3 - Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits, NUPAD 1992
SP - 71
EP - 76
BT - Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits, NUPAD 1992
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits, NUPAD 1992
Y2 - 31 May 1992 through 1 June 1992
ER -