The impact of embedded wafer level BGA package on the antenna performance
- M. Pourmousavi
- , M. Wojnowski
- , R. Agethen
- , R. Weigel
- , A. Hagelauer
- Friedrich-Alexander Universitat Erlangen-Nurnberg (FAU)
- Infineon Technologies AG
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
14
Scopus
citations