The effect of chloride on the underpotential deposition of copper on Pt(111): AES, LEED, RRDE, and X-ray scattering studies

Nenad M. Marković, Hubert A. Gasteiger, Chris A. Lucas, Ian M. Tidswell, Philip N. Ross

Research output: Contribution to journalArticlepeer-review

67 Scopus citations

Abstract

The details of the underpotential deposition (UPD) of Cu on Pt(111) in the presence of Cl- were re-examined using a combination of familiar ex-situ techniques (AES/LEED and new in-situ techniques, anomalous surface X-ray scattering (SXS) and Cu2+ flux measurements using a rotating ring disk configuration with the Pt(111) single crystal as the disk electrode. In combination these techniques show definitively that Cu UPD occurs in a two step process, the first being the formation of a Cu{single bond}Cl adlattice having a bi-layer structure similar to the (111) plane of CuCl, the second being the formation of a pseudomorphic Cu monolayer covered with a Cl adlayer. The latter appears to have a structure similar to the structure of Cl adsorbed on Cu(111) to saturation in UHV.

Original languageEnglish
Pages (from-to)91-100
Number of pages10
JournalSurface Science
Volume335
Issue numberC
DOIs
StatePublished - 20 Jul 1995
Externally publishedYes

Keywords

  • Adatoms
  • Adsorption kinetics
  • Auger electron spectroscopy
  • Bromine
  • Chemisorption
  • Chlorine
  • Copper
  • Electrochemical methods
  • Low energy electron diffraction (LEED)
  • Low index single crystal surfaces
  • Metal-electrolyte interfaces
  • Platinum
  • Solid-liquid interfaces
  • Surface structure roughness, Surface thermodynamics
  • X-ray scattering

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