Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

E. Glocker; S. Boppu; Q. Chen; U. Schlichtmann; J. Teich; D. Schmitt-Landsiedel

doi:10.5194/ars-12-103-2014

Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

E. Glocker, S. Boppu, Q. Chen, U. Schlichtmann, J. Teich, D. Schmitt-Landsiedel

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

Original language	English
Pages (from-to)	103-109
Number of pages	7
Journal	Advances in Radio Science
Volume	12
DOIs	https://doi.org/10.5194/ars-12-103-2014
State	Published - 10 Nov 2014

Access to Document

10.5194/ars-12-103-2014

Cite this

@article{49c1ee51d43b4b688e1491c60280cd8c,

title = "Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)",

abstract = "This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.",

author = "E. Glocker and S. Boppu and Q. Chen and U. Schlichtmann and J. Teich and D. Schmitt-Landsiedel",

year = "2014",

month = nov,

day = "10",

doi = "10.5194/ars-12-103-2014",

language = "English",

volume = "12",

pages = "103--109",

journal = "Advances in Radio Science",

issn = "1684-9965",

publisher = "Copernicus Publications",

}

TY - JOUR

T1 - Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

AU - Glocker, E.

AU - Boppu, S.

AU - Chen, Q.

AU - Schlichtmann, U.

AU - Teich, J.

AU - Schmitt-Landsiedel, D.

PY - 2014/11/10

Y1 - 2014/11/10

N2 - This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

AB - This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

UR - http://www.scopus.com/inward/record.url?scp=84913546698&partnerID=8YFLogxK

U2 - 10.5194/ars-12-103-2014

DO - 10.5194/ars-12-103-2014

M3 - Article

AN - SCOPUS:84913546698

SN - 1684-9965

VL - 12

SP - 103

EP - 109

JO - Advances in Radio Science

JF - Advances in Radio Science

ER -

Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

Abstract

Access to Document

Other files and links

Fingerprint

Cite this