TY - GEN
T1 - System level model of damping effects for highly perforated torsional microstructures
AU - Schrag, G.
AU - Sattler, R.
AU - Wachutka, G.
N1 - Publisher Copyright:
© 2002 Japan Soc. of Applied Physics.
PY - 2002
Y1 - 2002
N2 - We propose a mixed-level simulation scheme for squeeze film damping (SQFD) effects in microdevices, which makes it possible to include damping effects in system-level models of entire microsystems in a natural, physical-based, and flexible way. Our approach allows also for complex geometries, large deflections and coupling to other energy and signal domains. Applying the methodology to torsional structures yields results which are in excellent agreement with accurate FEM simulations based on the 3D Navier-Stokes equations, thus demonstrating the practicality and quality of our approach. For device geometries with densely distributed perforations we propose a further order reduction by merging adjacent holes in one equivalent network element; in this way we are able to simulate highly perforated structures at affordable computational expense. The predictive simulation of an industrial microrelay featuring 3000 perforations validated by experimental analysis, illustrates the power of our methodology.
AB - We propose a mixed-level simulation scheme for squeeze film damping (SQFD) effects in microdevices, which makes it possible to include damping effects in system-level models of entire microsystems in a natural, physical-based, and flexible way. Our approach allows also for complex geometries, large deflections and coupling to other energy and signal domains. Applying the methodology to torsional structures yields results which are in excellent agreement with accurate FEM simulations based on the 3D Navier-Stokes equations, thus demonstrating the practicality and quality of our approach. For device geometries with densely distributed perforations we propose a further order reduction by merging adjacent holes in one equivalent network element; in this way we are able to simulate highly perforated structures at affordable computational expense. The predictive simulation of an industrial microrelay featuring 3000 perforations validated by experimental analysis, illustrates the power of our methodology.
KW - Analytical models
KW - Computational geometry
KW - Computational modeling
KW - Computer networks
KW - Damping
KW - Distributed computing
KW - Merging
KW - Microstructure
KW - Navier-Stokes equations
KW - Solid modeling
UR - http://www.scopus.com/inward/record.url?scp=6344260982&partnerID=8YFLogxK
U2 - 10.1109/SISPAD.2002.1034529
DO - 10.1109/SISPAD.2002.1034529
M3 - Conference contribution
AN - SCOPUS:6344260982
T3 - International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
SP - 111
EP - 114
BT - 2002 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2002
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2002
Y2 - 4 September 2002 through 6 September 2002
ER -