TY - GEN
T1 - System CDM Modeling for High-Speed Interface Devices
AU - Groppo, Emanuele
AU - Gossner, Harald
AU - Domanski, Krzysztof
AU - Dua, Raj
AU - Gong, Jian
AU - Carn, Brett
AU - Zia, Victor
AU - Brederlow, Ralf
N1 - Publisher Copyright:
© 2024 ESD Association. All rights reserved.
PY - 2024
Y1 - 2024
N2 - Conventional simulation methods for Charged Device Model (CDM) peak current estimation, based on separate tester and IC lumped-element models, fail to capture fast transient phenomena at ultra-high-speed interfaces. A more comprehensive modeling approach, including on-die and package distributed parasitics, yields better predictive capabilities with respect to CDM qualification test results.
AB - Conventional simulation methods for Charged Device Model (CDM) peak current estimation, based on separate tester and IC lumped-element models, fail to capture fast transient phenomena at ultra-high-speed interfaces. A more comprehensive modeling approach, including on-die and package distributed parasitics, yields better predictive capabilities with respect to CDM qualification test results.
UR - https://www.scopus.com/pages/publications/85208422643
U2 - 10.23919/EOS/ESD61719.2024.10702134
DO - 10.23919/EOS/ESD61719.2024.10702134
M3 - Conference contribution
AN - SCOPUS:85208422643
T3 - Electrical Overstress/Electrostatic Discharge Symposium Proceedings
BT - Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2024, EOS/ESD 2024
PB - ESD Association
T2 - 46th Annual Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2024
Y2 - 16 September 2024 through 18 September 2024
ER -