Squeeze film damping in arbitrary shaped microdevices modelled by an accurate mixed level scheme

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Abstract

We propose a mixed level simulation scheme for squeeze film damping (SQFD) effects in microdevices, which allows for including the damping effects in system-level models of entire microsystems in a natural physical-based way. It also provides very large flexibility with respect to device geometry and the constituent components of a microsystem. The proposed damping model is realized in VHDL-AMS and can be easily included in system level models for full system simulation. The method has been successfully demonstrated for elementary micromechanical structures. The results from the mixed level simulation approach conform very well with 3D-Navier-Stokes-based FEM simulations showing the applicability of our methodology.

Original languageEnglish
Title of host publication2001 International Conference on Modeling and Simulation of Microsystems - MSM 2001
EditorsM. Laudon, B. Romanowicz
Pages92-95
Number of pages4
StatePublished - 2001
Event2001 International Conference on Modeling and Simulation of Microsystems - MSM 2001 - Hilton Head Island, SC, United States
Duration: 19 Mar 200121 Mar 2001

Publication series

Name2001 International Conference on Modeling and Simulation of Microsystems - MSM 2001

Conference

Conference2001 International Conference on Modeling and Simulation of Microsystems - MSM 2001
Country/TerritoryUnited States
CityHilton Head Island, SC
Period19/03/0121/03/01

Keywords

  • Compact modeling
  • Mixed level simulation
  • Non-trivial geometries
  • Squeeze film damping effects

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