TY - GEN
T1 - Solder Bumping for flip-chips with an electro-magnetic actuator
AU - Kessling, O. S.
AU - Irlinger, F.
AU - Lueth, T. C.
PY - 2008
Y1 - 2008
N2 - This paper reports an actuator for printing solder. Different types of solder can be printed: Sn63Pb37, Sn100, Sn96Ag4, and Sn97Cu3. The primary application of the print head is the field of flip-chip bumping. The advantage in this case is the flexible generation of solder balls on a circuit board without the need of using a screen printing mask. Measurements of printed solder bumps approve the functionality of the print head. A test layout for the placement of flip-chips is printed and the diameter and the height of the bumps are measured. The standard deviation is calculated in order to approve the repeatability of the process. In addition first solder columns, in order to reduce the thermal stress of the chip are printed. First chips were placed and the functionality of the chip substrate interconnection was verified.
AB - This paper reports an actuator for printing solder. Different types of solder can be printed: Sn63Pb37, Sn100, Sn96Ag4, and Sn97Cu3. The primary application of the print head is the field of flip-chip bumping. The advantage in this case is the flexible generation of solder balls on a circuit board without the need of using a screen printing mask. Measurements of printed solder bumps approve the functionality of the print head. A test layout for the placement of flip-chips is printed and the diameter and the height of the bumps are measured. The standard deviation is calculated in order to approve the repeatability of the process. In addition first solder columns, in order to reduce the thermal stress of the chip are printed. First chips were placed and the functionality of the chip substrate interconnection was verified.
UR - http://www.scopus.com/inward/record.url?scp=58149096293&partnerID=8YFLogxK
U2 - 10.1109/ESTC.2008.4684485
DO - 10.1109/ESTC.2008.4684485
M3 - Conference contribution
AN - SCOPUS:58149096293
SN - 9781424428144
T3 - Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
SP - 981
EP - 984
BT - Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
T2 - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Y2 - 1 September 2008 through 4 September 2008
ER -