TY - GEN
T1 - Simulation-based design of an electrostatically driven micro-actuator for fluid transport in mobile applications
AU - Seidl, M.
AU - Gehring, M.
AU - Krumbein, U.
AU - Schrag, G.
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/3
Y1 - 2019/3
N2 - The emerging lab-on-chip technology for in-situ medical use and environmental surveillance brought with it the demand for new, micro-scale actuator designs specialized in energy-efficient fluid transport, supporting the development of lightweight and mobile systems. In this work, we present the simulation-based design of a novel, integrated micro-fluidic actuator intended for mobile applications. The design is laid-out to be compatible with standard semiconductor manufacturing processes in order to enable mass-production at low cost per unit. The development of the device is supported and accelerated by a dedicated fully energy-coupled finite element model (FEM). The FE model takes into account the fluid-solid interaction in addition to the electro-mechanical interrelations, therefore reproducing the full device behavior in reaction to electrical input signals. In the end, we discuss several design parameters exhibiting space for improvement compared to the chosen standard values, as identified by the FEM simulations.
AB - The emerging lab-on-chip technology for in-situ medical use and environmental surveillance brought with it the demand for new, micro-scale actuator designs specialized in energy-efficient fluid transport, supporting the development of lightweight and mobile systems. In this work, we present the simulation-based design of a novel, integrated micro-fluidic actuator intended for mobile applications. The design is laid-out to be compatible with standard semiconductor manufacturing processes in order to enable mass-production at low cost per unit. The development of the device is supported and accelerated by a dedicated fully energy-coupled finite element model (FEM). The FE model takes into account the fluid-solid interaction in addition to the electro-mechanical interrelations, therefore reproducing the full device behavior in reaction to electrical input signals. In the end, we discuss several design parameters exhibiting space for improvement compared to the chosen standard values, as identified by the FEM simulations.
UR - http://www.scopus.com/inward/record.url?scp=85067483780&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2019.8724561
DO - 10.1109/EuroSimE.2019.8724561
M3 - Conference contribution
AN - SCOPUS:85067483780
T3 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
BT - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Y2 - 24 March 2019 through 27 March 2019
ER -