TY - GEN
T1 - Simulation and measurement of pressure dependent Q-factors in NEMS resonators
AU - Manz, J.
AU - Schrag, G.
AU - Wachutka, G.
PY - 2014
Y1 - 2014
N2 - The fluidic damping and the hereof resulting Q-factor of various mechanical resonators with gaps of nanometer size between suspended part and substrate was theoretically and experimentally determined. These investigations have been carried out in the pressure regime from atmospheric pressure down to about 3 Pa. The air flow in the nanogap between the movable part of the device and the substrate was modeled by extending the mixed level model presented in [1, 2] to the slip flow and molecular dynamical regime. The pressure-dependent measurements were carried out using a Laser-Doppler vibrometer. The extracted Q factors conform very well with those expected from theory in every pressure regime. This is a noticeable result, because even at normal pressure the range of validity for a continuum-theoretical description is reached for the nanometer feature sizes considered in this work.
AB - The fluidic damping and the hereof resulting Q-factor of various mechanical resonators with gaps of nanometer size between suspended part and substrate was theoretically and experimentally determined. These investigations have been carried out in the pressure regime from atmospheric pressure down to about 3 Pa. The air flow in the nanogap between the movable part of the device and the substrate was modeled by extending the mixed level model presented in [1, 2] to the slip flow and molecular dynamical regime. The pressure-dependent measurements were carried out using a Laser-Doppler vibrometer. The extracted Q factors conform very well with those expected from theory in every pressure regime. This is a noticeable result, because even at normal pressure the range of validity for a continuum-theoretical description is reached for the nanometer feature sizes considered in this work.
UR - https://www.scopus.com/pages/publications/84901438349
U2 - 10.1109/EuroSimE.2014.6813858
DO - 10.1109/EuroSimE.2014.6813858
M3 - Conference contribution
AN - SCOPUS:84901438349
SN - 9781479947904
T3 - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
BT - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
PB - IEEE Computer Society
T2 - 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
Y2 - 7 April 2014 through 9 April 2014
ER -