@article{f50d15a7b1de483b87824c323dad2ce5,
title = "SiCer: Meeting the Challenges of Tomorrow's Complex Electronic Systems [From the Guest Editors' Desk]",
author = "Uwe Stehr and Amelie Hagelauer and Hein, {Matthias A.}",
note = "Funding Information: An alternative carrier substrate targeting applications that combine MEMS components and microelec tronic devices at RF frequencies has been developed by a group of German scientists. This substrate, called silicon ceramic (SiCer), is a composite fabricated by combining a multilayer low-temperature cofired ceramic (LTCC) carrier with an Si wafer. Working with this technology, researchers from the Technische Universit{\"a}t Ilmenau, Germany; Friedrich-Alexander-Universit{\"a}t Erlangen-N{\"u}rnberg, Germany; and Institut f{\"u}r Mikroelektronik und Mechatroniksysteme Ilmenau teamed up to establish design concepts for tightly integrated RF modules that combine MEMS devices with active and passive RF components. The well-known V-model design methodology (top-down component design followed by a bottom-up verification of system performance) was adapted to the SiCer technology platform for this purpose. For their work, the researchers established a study unit, Multiphysical Synthesis and Integration of Complex RF Circuits (MUSIK), funded by the German Research Foundation, Bonn.",
year = "2019",
month = oct,
doi = "10.1109/MMM.2019.2928614",
language = "English",
volume = "20",
pages = "26--92",
journal = "IEEE Microwave Magazine",
issn = "1527-3342",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "10",
}