Sensor fabrication using thin film-on-silicon approaches

G. Müller, P. P. Deimel, W. Hellmich, C. Wagner

Research output: Contribution to journalArticlepeer-review

24 Scopus citations

Abstract

Monocrystalline silicon wafers (c-Si) form the material base for the modern microelectronics industry. In recent years, c-Si has also become increasingly important as a mechanical material. The possibility of integrating electronic components into micromachined mechanical structures makes c-Si an increasingly interesting material for the fabrication of microsensor and microactuator devices. This paper presents a number of examples which demonstrate how thin films can be used in combination with micromachined silicon substrates or silicon wafers containing pre-fabricated electronic circuits. The examples presented include optoelectronic, integrated optic, mechanical, thermal and chemical sensor devices.

Original languageEnglish
Pages (from-to)157-163
Number of pages7
JournalThin Solid Films
Volume296
Issue number1-2
DOIs
StatePublished - Mar 1997
Externally publishedYes

Keywords

  • Optoelectronics
  • Sensor fabrication
  • Silicon wafers

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