Scaling properties and electromigration resistance of sputtered Ag metallization lines

M. Hauder; J. Gstöttner; W. Hansch; D. Schmitt-Landsiedel

doi:10.1063/1.1345801

Scaling properties and electromigration resistance of sputtered Ag metallization lines

M. Hauder, J. Gstöttner, W. Hansch, D. Schmitt-Landsiedel

Medicine and Health

Technical University of Munich

Research output: Contribution to journal › Article › peer-review

119 Scopus citations

Abstract

Resistivity and electromigration were investigated for thin sputtered Ag films and microstructured Ag lines. Resistivities of thin films were found to be lower compared to copper and follow the prediction of the size effect. Microstructured Ag lines show a high electromigration resistance at accelerated stress measurements. Considering joule heating of the lines, the activation energy for electromigration was found to be 0.58 eV. The extrapolated median lifetime of Ag lines was found to be similar or higher than for Cu lines.

Original language	English
Pages (from-to)	838-840
Number of pages	3
Journal	Applied Physics Letters
Volume	78
Issue number	6
DOIs	https://doi.org/10.1063/1.1345801
State	Published - 5 Feb 2001

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abstract = "Resistivity and electromigration were investigated for thin sputtered Ag films and microstructured Ag lines. Resistivities of thin films were found to be lower compared to copper and follow the prediction of the size effect. Microstructured Ag lines show a high electromigration resistance at accelerated stress measurements. Considering joule heating of the lines, the activation energy for electromigration was found to be 0.58 eV. The extrapolated median lifetime of Ag lines was found to be similar or higher than for Cu lines.",

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N2 - Resistivity and electromigration were investigated for thin sputtered Ag films and microstructured Ag lines. Resistivities of thin films were found to be lower compared to copper and follow the prediction of the size effect. Microstructured Ag lines show a high electromigration resistance at accelerated stress measurements. Considering joule heating of the lines, the activation energy for electromigration was found to be 0.58 eV. The extrapolated median lifetime of Ag lines was found to be similar or higher than for Cu lines.

AB - Resistivity and electromigration were investigated for thin sputtered Ag films and microstructured Ag lines. Resistivities of thin films were found to be lower compared to copper and follow the prediction of the size effect. Microstructured Ag lines show a high electromigration resistance at accelerated stress measurements. Considering joule heating of the lines, the activation energy for electromigration was found to be 0.58 eV. The extrapolated median lifetime of Ag lines was found to be similar or higher than for Cu lines.

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Scaling properties and electromigration resistance of sputtered Ag metallization lines

Abstract

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