Scalable Physical Design for Silicon Dangling Bond Logic: How a 45° Turn Prevents the Reinvention of the Wheel

Simon Hofmann; Marcel Walter; Robert Wille

doi:10.1109/NANO58406.2023.10231278

Scalable Physical Design for Silicon Dangling Bond Logic: How a 45° Turn Prevents the Reinvention of the Wheel

Chair of Design Automation

Software Competence Center Hagenberg

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

25 Scopus citations

Abstract

With the ever-increasing demands of computing, post-CMOS technologies are sought after. Field-coupled Nanocomputing (FCN), which relies on physical field repulsion, is a class of technologies for energy-efficient computing. While the physical design for Quantum-dot Cellular Automata (QCA) has been researched for more than 20 years, the method-ologies for its promising successor, namely Silicon Dangling Bonds (SiDBs), have yet to catch up. To prevent reinventing the wheel and utilizing the 20 years of development in QCA, this paper presents a methodology to create SiDB designs based on existing QCA design approaches by a 45° rotation, implemented as a remapping algorithm. The presented approach enables the direct translation of QCA layouts to SiDB ones with minimal overhead and allows to tap knowledge from decades of research.

Original language	English
Title of host publication	2023 IEEE 23rd International Conference on Nanotechnology, NANO 2023
Publisher	IEEE Computer Society
Pages	872-877
Number of pages	6
ISBN (Electronic)	9798350333466
DOIs	https://doi.org/10.1109/NANO58406.2023.10231278
State	Published - 2023
Event	23rd IEEE International Conference on Nanotechnology, NANO 2023 - Jeju City, Korea, Republic of Duration: 2 Jul 2023 → 5 Jul 2023

Publication series

Name	Proceedings of the IEEE Conference on Nanotechnology
Volume	2023-July
ISSN (Print)	1944-9399
ISSN (Electronic)	1944-9380

Conference

Conference	23rd IEEE International Conference on Nanotechnology, NANO 2023
Country/Territory	Korea, Republic of
City	Jeju City
Period	2/07/23 → 5/07/23

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

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10.1109/NANO58406.2023.10231278

Cite this

Hofmann, S., Walter, M., & Wille, R. (2023). Scalable Physical Design for Silicon Dangling Bond Logic: How a 45° Turn Prevents the Reinvention of the Wheel. In 2023 IEEE 23rd International Conference on Nanotechnology, NANO 2023 (pp. 872-877). (Proceedings of the IEEE Conference on Nanotechnology; Vol. 2023-July). IEEE Computer Society. https://doi.org/10.1109/NANO58406.2023.10231278

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title = "Scalable Physical Design for Silicon Dangling Bond Logic: How a 45° Turn Prevents the Reinvention of the Wheel",

abstract = "With the ever-increasing demands of computing, post-CMOS technologies are sought after. Field-coupled Nanocomputing (FCN), which relies on physical field repulsion, is a class of technologies for energy-efficient computing. While the physical design for Quantum-dot Cellular Automata (QCA) has been researched for more than 20 years, the method-ologies for its promising successor, namely Silicon Dangling Bonds (SiDBs), have yet to catch up. To prevent reinventing the wheel and utilizing the 20 years of development in QCA, this paper presents a methodology to create SiDB designs based on existing QCA design approaches by a 45° rotation, implemented as a remapping algorithm. The presented approach enables the direct translation of QCA layouts to SiDB ones with minimal overhead and allows to tap knowledge from decades of research.",

author = "Simon Hofmann and Marcel Walter and Robert Wille",

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doi = "10.1109/NANO58406.2023.10231278",

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Hofmann, S , Walter, M & Wille, R 2023, Scalable Physical Design for Silicon Dangling Bond Logic: How a 45° Turn Prevents the Reinvention of the Wheel. in 2023 IEEE 23rd International Conference on Nanotechnology, NANO 2023. Proceedings of the IEEE Conference on Nanotechnology, vol. 2023-July, IEEE Computer Society, pp. 872-877, 23rd IEEE International Conference on Nanotechnology, NANO 2023, Jeju City, Korea, Republic of, 2/07/23. https://doi.org/10.1109/NANO58406.2023.10231278

Scalable Physical Design for Silicon Dangling Bond Logic: How a 45° Turn Prevents the Reinvention of the Wheel. / Hofmann, Simon ; Walter, Marcel ; Wille, Robert.
2023 IEEE 23rd International Conference on Nanotechnology, NANO 2023. IEEE Computer Society, 2023. p. 872-877 (Proceedings of the IEEE Conference on Nanotechnology; Vol. 2023-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - With the ever-increasing demands of computing, post-CMOS technologies are sought after. Field-coupled Nanocomputing (FCN), which relies on physical field repulsion, is a class of technologies for energy-efficient computing. While the physical design for Quantum-dot Cellular Automata (QCA) has been researched for more than 20 years, the method-ologies for its promising successor, namely Silicon Dangling Bonds (SiDBs), have yet to catch up. To prevent reinventing the wheel and utilizing the 20 years of development in QCA, this paper presents a methodology to create SiDB designs based on existing QCA design approaches by a 45° rotation, implemented as a remapping algorithm. The presented approach enables the direct translation of QCA layouts to SiDB ones with minimal overhead and allows to tap knowledge from decades of research.

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Scalable Physical Design for Silicon Dangling Bond Logic: How a 45° Turn Prevents the Reinvention of the Wheel

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