TY - GEN
T1 - Sampling-based buffer insertion for post-silicon yield improvement under process variability
AU - Zhang, Grace Li
AU - Li, Bing
AU - Schlichtmann, Ulf
N1 - Publisher Copyright:
© 2016 EDAA.
PY - 2016/4/25
Y1 - 2016/4/25
N2 - At submicron manufacturing technology nodes process variations affect circuit performance significantly. This trend leads to a large timing margin and thus overdesign to maintain yield. To combat this pessimism, post-silicon clock tuning buffers can be inserted into circuits to balance timing budgets of critical paths with their neighbors. After manufacturing, these clock buffers can be configured for each chip individually so that chips with timing failures may be rescued to improve yield. In this paper, we propose a sampling-based method to determine the proper locations of these buffers. The goal of this buffer insertion is to reduce the number of buffers and their ranges, while still maintaining a good yield improvement. Experimental results demonstrate that our algorithm can achieve a significant yield improvement (up to 35%) with only a small number of buffers.
AB - At submicron manufacturing technology nodes process variations affect circuit performance significantly. This trend leads to a large timing margin and thus overdesign to maintain yield. To combat this pessimism, post-silicon clock tuning buffers can be inserted into circuits to balance timing budgets of critical paths with their neighbors. After manufacturing, these clock buffers can be configured for each chip individually so that chips with timing failures may be rescued to improve yield. In this paper, we propose a sampling-based method to determine the proper locations of these buffers. The goal of this buffer insertion is to reduce the number of buffers and their ranges, while still maintaining a good yield improvement. Experimental results demonstrate that our algorithm can achieve a significant yield improvement (up to 35%) with only a small number of buffers.
UR - http://www.scopus.com/inward/record.url?scp=84973601921&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84973601921
T3 - Proceedings of the 2016 Design, Automation and Test in Europe Conference and Exhibition, DATE 2016
SP - 1457
EP - 1460
BT - Proceedings of the 2016 Design, Automation and Test in Europe Conference and Exhibition, DATE 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016
Y2 - 14 March 2016 through 18 March 2016
ER -