TY - GEN
T1 - Reliable system-level models for electrostatically actuated devices under varying ambient conditions
T2 - 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2011
AU - Schrag, Gabriele
AU - Niessner, Martin
AU - Wachutka, Gerhard
PY - 2011
Y1 - 2011
N2 - We present a physics-based multi-energy domain macromodel that allows - in general - for the efficient simulation of any electrostatic actuator within standard IC frameworks and apply it exemplarily to an RF-MEMS switch. The predictive power of this macromodel, which depends crucially on the quality of the applied damping and contact models, has been evaluated by white light interferometer and laser vibrometer measurements. It turned out that the models for viscous damping as well as for the electromechanical energy domain are in very good agreement with the experiments while the applied standard contact model fails in reproducing the measured contact phenomena. Based on these findings suggestions for improved system-level contact models are discussed.
AB - We present a physics-based multi-energy domain macromodel that allows - in general - for the efficient simulation of any electrostatic actuator within standard IC frameworks and apply it exemplarily to an RF-MEMS switch. The predictive power of this macromodel, which depends crucially on the quality of the applied damping and contact models, has been evaluated by white light interferometer and laser vibrometer measurements. It turned out that the models for viscous damping as well as for the electromechanical energy domain are in very good agreement with the experiments while the applied standard contact model fails in reproducing the measured contact phenomena. Based on these findings suggestions for improved system-level contact models are discussed.
UR - https://www.scopus.com/pages/publications/84881043986
M3 - Conference contribution
AN - SCOPUS:84881043986
SN - 9782355000133
T3 - DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
SP - 8
EP - 13
BT - DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Y2 - 11 May 2011 through 13 May 2011
ER -