Abstract
In power electronic packages wire bonding is used for the electrical contact of the chips and for interconnections on the module substrate. Limiting factors for the reliability are solder fatigue and wire bond failures. In this work we investigate the material fatigue of aluminum bonding wires stressed by cyclic lateral bonding area displacement. Bond wire heel crack failures observed by experiments are found to be strongly dependent on the loop geometry. Based on a finite element model that accounts for elastic-plastic material properties, a life-tune model for the Al wire (Coffin-Manson representation) is derived from the experiments.
| Original language | English |
|---|---|
| Pages (from-to) | 1521-1525 |
| Number of pages | 5 |
| Journal | Microelectronics Reliability |
| Volume | 40 |
| Issue number | 8-10 |
| DOIs | |
| State | Published - 2000 |