TY - GEN
T1 - Recent Trends in Wafer-Level Package Technology
AU - Schmidbauer, Philipp
AU - Wojnowski, MacIej
AU - Pressel, Klaus
AU - Weigel, Robert
AU - Hagelauer, Amelie
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/9/20
Y1 - 2020/9/20
N2 - The fast growing market for system-in-package (SiP) solutions goes along with the continous evolution of important integration platforms such as the embedded wafer-level ball grid array (eWLB) package. In this article, we highlight three important design trends for eWLB technology: Diversified antenna-in-package (AiP) concepts, massive off-chip circuitry and a modularized toolbox design approach. We show, how those trends are driven by novel application fields in various areas.
AB - The fast growing market for system-in-package (SiP) solutions goes along with the continous evolution of important integration platforms such as the embedded wafer-level ball grid array (eWLB) package. In this article, we highlight three important design trends for eWLB technology: Diversified antenna-in-package (AiP) concepts, massive off-chip circuitry and a modularized toolbox design approach. We show, how those trends are driven by novel application fields in various areas.
KW - SiP
KW - eWLB
KW - heterogeneous integration
UR - http://www.scopus.com/inward/record.url?scp=85102563860&partnerID=8YFLogxK
U2 - 10.1109/IWS49314.2020.9360140
DO - 10.1109/IWS49314.2020.9360140
M3 - Conference contribution
AN - SCOPUS:85102563860
T3 - 2020 IEEE MTT-S International Wireless Symposium, IWS 2020 - Proceedings
BT - 2020 IEEE MTT-S International Wireless Symposium, IWS 2020 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE MTT-S International Wireless Symposium, IWS 2020
Y2 - 20 September 2020 through 23 September 2020
ER -