TY - GEN
T1 - Quantifizierung der mechanischen Zuverlässigkeit von MEMS mittels experimenteller und numerischer Verfahren
AU - Ampunant, Waschriporn
AU - Schrag, Gabriele
AU - Ganzhorn, Kathrin
AU - Laumer, Bernhard
N1 - Publisher Copyright:
© VDE VERLAG GMBH · Berlin · Offenbach
PY - 2019
Y1 - 2019
N2 - Micro-Electro-Mechanical Systems (MEMS) have become increasingly important for commercial application as they are extremely versatile. Hence, knowing the operating lifetime of MEMS is indispensable. A significant aspect for determining the operating lifetime of MEMS devices is their mechanical reliability, for which the prediction of consistent methods is under current research. The objective of this work is to quantify the mechanical reliability of MEMS by coupling experimental and numerical methods. The first step is to analyze the failure mechanism by determining relevant parameters from the respective experiments. These parameters are used for simulations to examine failure mechanisms of MEMS devices. Finally, suitable methods to analyze the reliability and robustness shall be derived.
AB - Micro-Electro-Mechanical Systems (MEMS) have become increasingly important for commercial application as they are extremely versatile. Hence, knowing the operating lifetime of MEMS is indispensable. A significant aspect for determining the operating lifetime of MEMS devices is their mechanical reliability, for which the prediction of consistent methods is under current research. The objective of this work is to quantify the mechanical reliability of MEMS by coupling experimental and numerical methods. The first step is to analyze the failure mechanism by determining relevant parameters from the respective experiments. These parameters are used for simulations to examine failure mechanisms of MEMS devices. Finally, suitable methods to analyze the reliability and robustness shall be derived.
UR - http://www.scopus.com/inward/record.url?scp=85096786814&partnerID=8YFLogxK
M3 - Konferenzbeitrag
AN - SCOPUS:85096786814
T3 - MikroSystemTechnik Kongress 2019 - Mikroelektronik MEMS-MOEMS Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings
SP - 698
EP - 701
BT - MikroSystemTechnik Kongress 2019 - Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings
PB - VDE VERLAG GMBH
T2 - MikroSystemTechnik Kongress 2019: Mikroelektronik, MEMS-MOEMS, Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz - MikroSystemTechnik Congress 2019: Microelectronics, MEMS-MOEMS, System Integration - Pillars of Digitization and Artificial Intelligence
Y2 - 28 October 2019 through 30 October 2019
ER -