Abstract
Assembly is a crucial process during the production of microsystems. Especially automated and economic assembly of flip-chip at small and medium batch sizes is not solved at the moment in industry. For flexible and economic assembly of standard and flip-chip elements a tool was developed, which makes it possible to assemble MOEMS with an accuracy of less than 8 micrometers by a standard industrial robot. This is done by integrating a fine positioning drive and sensors into the tool. Moreover, a special optics module for the assembly of flip-chip elements was developed, which can be used in different positioning devices in a manual and automatic modus.
Original language | English |
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Pages (from-to) | 395-402 |
Number of pages | 8 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 4178 |
DOIs | |
State | Published - 2000 |
Event | MOEMS and Miniaturized Systems 2000 - Santa Clara, United States Duration: 18 Sep 2000 → 21 Sep 2000 |
Keywords
- Flip-chip assembly
- Micro-assembly
- Optic development
- Positioning strategies
- Sensor integration
- Tool development