TY - GEN
T1 - Physics-Based System-level Modeling of Acoustic MEMS Transducers by Generalized Kirchhoffian Networks
T2 - 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2024
AU - Schrag, Gabriele
AU - Bosetti, Gabriele
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Two exemplary applications from the field of acoustic and ultrasonic transducers are used to demonstrate how system models can be derived using a generic thermodynamic framework in a way that they are optimally adapted to the problem in terms of their level of abstraction. The models are formulated as generalized Kirchhoff networks and are physics-based, so that relevant design parameters are accessible at system level. First, the flexibility of the method w.r.t. true to detail modeling is shown for the case of a silicon microphone. Second, the efficiency of the approach is demonstrated by an automated optimization example of a system consisting of an ultrasonic transducer coupled to an acoustic horn. In future perspective, this methodology shows the potential to become the basis for a uniform and comprehensive platform towards microsystem design and optimization that can be modularly and flexibly adapted to new problems and requirements.
AB - Two exemplary applications from the field of acoustic and ultrasonic transducers are used to demonstrate how system models can be derived using a generic thermodynamic framework in a way that they are optimally adapted to the problem in terms of their level of abstraction. The models are formulated as generalized Kirchhoff networks and are physics-based, so that relevant design parameters are accessible at system level. First, the flexibility of the method w.r.t. true to detail modeling is shown for the case of a silicon microphone. Second, the efficiency of the approach is demonstrated by an automated optimization example of a system consisting of an ultrasonic transducer coupled to an acoustic horn. In future perspective, this methodology shows the potential to become the basis for a uniform and comprehensive platform towards microsystem design and optimization that can be modularly and flexibly adapted to new problems and requirements.
KW - acoustic transducers
KW - airborne ultrasound transducers
KW - automatic optimization
KW - multi-physics modeling
KW - system-level modeling
UR - http://www.scopus.com/inward/record.url?scp=85202339608&partnerID=8YFLogxK
U2 - 10.1109/DTIP62575.2024.10613058
DO - 10.1109/DTIP62575.2024.10613058
M3 - Conference contribution
AN - SCOPUS:85202339608
T3 - 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2024
BT - 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2024
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 2 June 2024 through 5 June 2024
ER -