TY - GEN
T1 - Periodic thermal management for hard real-time systems
AU - Cheng, Long
AU - Huang, Kai
AU - Chen, Gang
AU - Hu, Biao
AU - Knoll, Alois
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/8/10
Y1 - 2015/8/10
N2 - Due to growing power density, on-chip temperature increases rapidly, which has hampered the reliability and performance of modern real-time systems. This paper studies how to minimize the peak temperature for hard real-time systems under hard real-time constraints with periodic thermal management. A closed-form representation of the peak temperature for such a periodic scheme is derived to tackle this problem. Based on this closed-form and the arrival curve model which is used to model the system workload, two approaches that can derive periodic thermal management are proposed to minimize the peak temperature for a given event stream with a trade-off between complexity and accuracy. Case studies show that our approaches can achieve similar or better level of peak temperature but with two or three orders of magnitude lower computation expense compared to previous work.
AB - Due to growing power density, on-chip temperature increases rapidly, which has hampered the reliability and performance of modern real-time systems. This paper studies how to minimize the peak temperature for hard real-time systems under hard real-time constraints with periodic thermal management. A closed-form representation of the peak temperature for such a periodic scheme is derived to tackle this problem. Based on this closed-form and the arrival curve model which is used to model the system workload, two approaches that can derive periodic thermal management are proposed to minimize the peak temperature for a given event stream with a trade-off between complexity and accuracy. Case studies show that our approaches can achieve similar or better level of peak temperature but with two or three orders of magnitude lower computation expense compared to previous work.
KW - Decision support systems
KW - Optical wavelength conversion
KW - Rail to rail outputs
KW - Three-dimensional displays
UR - http://www.scopus.com/inward/record.url?scp=84959511356&partnerID=8YFLogxK
U2 - 10.1109/SIES.2015.7185040
DO - 10.1109/SIES.2015.7185040
M3 - Conference contribution
AN - SCOPUS:84959511356
T3 - 2015 10th IEEE International Symposium on Industrial Embedded Systems, SIES 2015 - Proceedings
SP - 49
EP - 58
BT - 2015 10th IEEE International Symposium on Industrial Embedded Systems, SIES 2015 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 10th IEEE International Symposium on Industrial Embedded Systems, SIES 2015
Y2 - 8 June 2015 through 10 June 2015
ER -