TY - GEN
T1 - Performance improvement of embedded low-power microprocessor cores by selective flip flop replacement
AU - Baumann, T.
AU - Berthold, J.
AU - Niedermeier, T.
AU - Schoenauer, T.
AU - Dienstuhl, J.
AU - Schmitt-Landsiedel, D.
AU - Pacha, C.
PY - 2007
Y1 - 2007
N2 - Performance improvement of an ARM926 microprocessor core by selective replacement of standard master-slave flip flops using low-VT flip flops or a novel type of pulsed flip flop (P-FF) is investigated. Different replacement strategies are proposed that are independent of path and pipeline topologies. These strategies are compared to each other concerning performance improvement and costs. For an existing 90nm CMOS design a 5% speed improvement on design level is achieved at low area overhead of 1%. An experimental verification of the proposed concept using a loop of critical paths shows 12% speed increase at 500MHz and VDD=1.2V in a 65nm CMOS technology.
AB - Performance improvement of an ARM926 microprocessor core by selective replacement of standard master-slave flip flops using low-VT flip flops or a novel type of pulsed flip flop (P-FF) is investigated. Different replacement strategies are proposed that are independent of path and pipeline topologies. These strategies are compared to each other concerning performance improvement and costs. For an existing 90nm CMOS design a 5% speed improvement on design level is achieved at low area overhead of 1%. An experimental verification of the proposed concept using a loop of critical paths shows 12% speed increase at 500MHz and VDD=1.2V in a 65nm CMOS technology.
UR - http://www.scopus.com/inward/record.url?scp=44849136983&partnerID=8YFLogxK
U2 - 10.1109/ESSCIRC.2007.4430305
DO - 10.1109/ESSCIRC.2007.4430305
M3 - Conference contribution
AN - SCOPUS:44849136983
SN - 1424411254
SN - 9781424411252
T3 - ESSCIRC 2007 - Proceedings of the 33rd European Solid-State Circuits Conference
SP - 308
EP - 311
BT - ESSCIRC 2007 - Proceedings of the 33rd European Solid-State Circuits Conference
T2 - ESSCIRC 2007 - 33rd European Solid-State Circuits Conference
Y2 - 11 September 2007 through 13 September 2007
ER -