Overview of carbon nanotube processing methods

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

On February 16, in year 2000, the first patent application was filed that proposed to use carbon nanotubes (CNTs) instead of metals as vertical interconnects in advanced microelectronic interconnects on semiconductor chips [1]. This patent, which has been cited in over 150 following patent applications as prior art, emphasizes that CNTs would be especially useful in vertical interconnects (vias). The quasi-ballistic current transport in CNTs would allow very efficient low resistance interconnects which can mitigate the observed reliability issues in advanced semiconductor interconnects [2].

Original languageEnglish
Title of host publicationCarbon Nanotubes for Interconnects
Subtitle of host publicationProcess, Design and Applications
PublisherSpringer International Publishing
Pages81-100
Number of pages20
ISBN (Electronic)9783319297460
ISBN (Print)9783319297446
DOIs
StatePublished - 1 Jan 2016

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