Novel surface-micromachined thermal actuator for fracture and reliability characterisation of polysilicon by electrical wafer-level testing

H. Kapels, J. Urscher, R. Aigner, R. Sattler, G. Wachutka, J. Binder

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A novel thermal actuator for the determination of polysilicon fracture strength and investigation of its long-term stability is presented. The actuator consists of two narrow beams which expand due to electrical heating and a cold plate where a short tensile fracture beam is fixed. The structure is very small (300μm long), and can be characterised electrically. The method is suitable for tensile and compressive materials, for integration and for on- Waftr tests in process control. Using a finite-element solver a model for the temperature and stress distribution has been established. Tensile fracture strength for polysilicon has been found to be (3,1±0,4)GPa. Ongoing long-term-investigations have not yet shown any mechanical ageing effects on polysilicon.

Original languageEnglish
Title of host publicationESSDERC 1999 - Proceeding of the 29th European Solid-State Device Research Conference
EditorsR.P. Mertens, H. Grunbacher, H.E. Maes, G. Declerck
PublisherIEEE Computer Society
Pages324-327
Number of pages4
ISBN (Electronic)2863322451, 9782863322451
StatePublished - 1999
Event29th European Solid-State Device Research Conference, ESSDERC 1999 - Leuven, Belgium
Duration: 13 Sep 199915 Sep 1999

Publication series

NameEuropean Solid-State Device Research Conference
Volume13-15 Sept. 1999
ISSN (Print)1930-8876

Conference

Conference29th European Solid-State Device Research Conference, ESSDERC 1999
Country/TerritoryBelgium
CityLeuven
Period13/09/9915/09/99

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