@inproceedings{11a062b4470a423b88d69771fec6eec1,
title = "Novel surface-micromachined thermal actuator for fracture and reliability characterisation of polysilicon by electrical wafer-level testing",
abstract = "A novel thermal actuator for the determination of polysilicon fracture strength and investigation of its long-term stability is presented. The actuator consists of two narrow beams which expand due to electrical heating and a cold plate where a short tensile fracture beam is fixed. The structure is very small (300μm long), and can be characterised electrically. The method is suitable for tensile and compressive materials, for integration and for on- Waftr tests in process control. Using a finite-element solver a model for the temperature and stress distribution has been established. Tensile fracture strength for polysilicon has been found to be (3,1±0,4)GPa. Ongoing long-term-investigations have not yet shown any mechanical ageing effects on polysilicon.",
author = "H. Kapels and J. Urscher and R. Aigner and R. Sattler and G. Wachutka and J. Binder",
year = "1999",
language = "English",
series = "European Solid-State Device Research Conference",
publisher = "IEEE Computer Society",
pages = "324--327",
editor = "R.P. Mertens and H. Grunbacher and H.E. Maes and G. Declerck",
booktitle = "ESSDERC 1999 - Proceeding of the 29th European Solid-State Device Research Conference",
note = "29th European Solid-State Device Research Conference, ESSDERC 1999 ; Conference date: 13-09-1999 Through 15-09-1999",
}