@inproceedings{8aff5a18bfbd4903a1b0e60e87e62f48,
title = "Non-contact handling and transportation for substrates and microassembly using ultrasound-air-film-technology",
abstract = "The requirements needing to be met by handling technologies and factory automation in semiconductor fabrication and microsystem s technology are rising relentlessly. Fragile, surface-sensitive and thinned substrates call for new, innovative approaches in order to tackle numerous material handling tasks. Therefore a new upcoming handling technology based on the ultrasound-air-film- technology and its applications for non-contact handling in PV-Thin-Film and microassembly are presented in this paper.",
keywords = "Air-Film, Microassembly, Non-contact-Handling, PV-Thin-Film, Ultrasonic, Ultrasound",
author = "Gunther Reinhart and Michael Heinz and Johannes Stock and Josef Zimmermann and Michael Schilp and Adolf Zitzmann and Jens Hellwig",
year = "2011",
doi = "10.1109/ASMC.2011.5898208",
language = "English",
isbn = "9781612844084",
series = "ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings",
booktitle = "2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2011",
note = "2011 22nd Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2011 ; Conference date: 16-05-2011 Through 18-05-2011",
}