No-Reference Image Quality Assessment for Reverse Engineering of Integrated Circuits

Ann Christin Bette, Robin Falter, Matthias Ludwig, Bernhard Lippmann, Frank Siegelin, Peter Egger, Alois Knoll

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Acquiring images of the layout of integrated circuits increases the demands on electron microscopy as the technology scaling continues. Each new chip generation makes producing stable and processable image quality more difficult. Currently, no automated, technology-agnostic solution supports the human operator in creating optimal layout images. Therefore, we propose an image quality assessment framework that determines the optimal microscope settings for each technology sample. We define the optimal settings as the minimum possible scan time, which still maintains the processability of the acquired images. The two implemented machine learning algorithms do not require a noise and distortion-free reference image. We compare both models on an updated version of the REFICS dataset and investigate their behavior for different noise types. Finally, we use our framework to fully recover the layout of a 28nm technology, reducing scan time by more than 95%.

Original languageEnglish
Title of host publication2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350301649
DOIs
StatePublished - 2023
Event2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 - Pulau Pinang, Malaysia
Duration: 24 Jul 202327 Jul 2023

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume2023-July

Conference

Conference2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
Country/TerritoryMalaysia
CityPulau Pinang
Period24/07/2327/07/23

Keywords

  • IC image analysis
  • IC reverse engineering
  • Layout validation
  • No-reference image quality assessment
  • Physical inspection
  • SEM imaging

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