New simulation procedure for accurate package modeling considering chip-package interaction

E. Seler, M. Wojnowski, R. Weigel, A. Hagelauer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

This paper presents a novel simulation procedure for full-wave electromagnetic simulations for generating package models taking into account chip-package interaction. If a simulated structure is split into two sub simulations, the accuracy of the overall simulation decreases. This is mainly the case if no clean separation of a composition into sub simulations is possible due to interactions between the sub domains. We show by means of a simple example of an embedded Wafer Level Ball grid array (eWLB) package that the simulation results of a cascade of an eWLB package and a chip are different to the simulation of the complete composition. The proposed simulation procedure delivers a package model with the package-chip interactions included and therefore cascading with integrated circuit model is possible with a higher accuracy. We show that the simulation results of a cascade of a package model obtained with the new procedure and a chip are virtually equal to a simulation of the whole composition. Furthermore we show that the created model of the package obtained from the proposed procedure is independent of the electrical circuit on the chip. This proves that the separation of the package from the chip with the proposed procedure is valid.

Original languageEnglish
Title of host publication2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013
PublisherIEEE Computer Society
Pages43-46
Number of pages4
ISBN (Print)9781467325363
DOIs
StatePublished - 2013
Externally publishedYes
Event2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013 - San Jose, CA, United States
Duration: 27 Oct 201330 Oct 2013

Publication series

Name2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013

Conference

Conference2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013
Country/TerritoryUnited States
CitySan Jose, CA
Period27/10/1330/10/13

Keywords

  • 3D EM simulation
  • eWLB
  • package modeling
  • simulation accuracy

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