@inproceedings{7294102037eb4f1d8c2c16cc09fd5004,
title = "New approach in MEMS integration with UV laser microcutting",
abstract = "This paper presents laser micro-cutting through-holes in 300 μm thick silicon wafers with a nanosecond UV laser under freely definable angles. The key process is the deflection of the laser beam by a front surface mirror with an aluminium coating and the associated challenge of focusing.",
author = "M. Kagerer and R. Behlert and F. Irlinger and Lueth, \{T. C.\}",
year = "2011",
language = "English",
series = "Proceedings of the 11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011",
publisher = "euspen",
pages = "140--143",
editor = "P. Shore and Henny Spaan and \{Van Brussel\}, H. and Theresa Burke",
booktitle = "Proceedings of the 11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011",
note = "11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011 ; Conference date: 23-05-2011 Through 26-05-2011",
}