Network-oriented models of transmission line structures in MMICs

D. Lukashevich, P. Russer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Further reduction of microwave monolithic integrated circuit (MMIC) dimensions will require multilayered wiring and transmission line structures with cross-sectional dimensions of the conductors in the order of micrometers. In order to achieve further reduction in conductor losses, copper is also considered for internal wiring. The exact modelling of the transmission properties of the line structures requires full-wave modelling of the electromagnetic field in the semiconductor and insulator regions as well as within the conductors. In this paper various transmission line structures have been analyzed using the mode matching (MM) approach. Based on the numerical simulation of the transmission lines equivalent network-oriented models (NOMs) are extracted.

Original languageEnglish
Title of host publication2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems - Digest of Papers
EditorsGeorge E. Ponchak
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages178-181
Number of pages4
ISBN (Electronic)0780377877, 9780780377875
DOIs
StatePublished - 2003
Event4th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems - Grainau, Germany
Duration: 11 Apr 2003 → …

Publication series

Name2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems - Digest of Papers

Conference

Conference4th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
Country/TerritoryGermany
CityGrainau
Period11/04/03 → …

Keywords

  • Conductors
  • Copper
  • Distributed parameter circuits
  • Electromagnetic fields
  • Electromagnetic modeling
  • Insulation
  • MMICs
  • Monolithic integrated circuits
  • Transmission lines
  • Wiring

Fingerprint

Dive into the research topics of 'Network-oriented models of transmission line structures in MMICs'. Together they form a unique fingerprint.

Cite this