Abstract
We present a planar multichip module integration technology intended for high frequency applications. Bare dice are placed in substrate openings and connected thru a thin film multilayer realized in a planar fashion on top of the embedded system. It is built of dielectric polymer layers and a sputtered/electroplated copper wiring on ceramic or silicon substrate. Polyimid Pyralin (2722 (Du Pont) and Cyclotene (4026-46 (Dow Chemical) are used as interlevel dielectric. Metalization is based on a Ti:W/Cu tie layer, which is subsequently electroplated with Cu. The paper also addresses high frequency performance of the described technology, electromagnetic full-wave modeling and equivalent circuit model extraction.
| Original language | English |
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| Pages | 91-96 |
| Number of pages | 6 |
| State | Published - 1998 |
| Event | Proceedings of the 1998 URSI International Symposium on Signals, Systems, and Electronics, ISSSE'98 - Pisa, Italy Duration: 29 Sep 1998 → 2 Oct 1998 |
Conference
| Conference | Proceedings of the 1998 URSI International Symposium on Signals, Systems, and Electronics, ISSSE'98 |
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| City | Pisa, Italy |
| Period | 29/09/98 → 2/10/98 |
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