TY - GEN
T1 - Multi-terminal pulsed force & sense ESD verification of I/O libraries and ESD simulations
AU - Drüen, Stephan
AU - Streibl, Martin
AU - Esmark, Kai
AU - Domanski, Krzysztof
AU - Niemesheim, Josef
AU - Gossner, Harald
AU - Schmitt-Landsiedel, Doris
PY - 2004
Y1 - 2004
N2 - A multi-terminal TLP measurement technique is used for accessing current and voltage distributions during ESD in typical I/O cell frames in a 0.13um CMOS technology. The procedure extends traditional I/O library testchip based ESD verification and qualification tests, allows to calibrate ESD chip-level simulation tools and to derive precise I/O library application rules.
AB - A multi-terminal TLP measurement technique is used for accessing current and voltage distributions during ESD in typical I/O cell frames in a 0.13um CMOS technology. The procedure extends traditional I/O library testchip based ESD verification and qualification tests, allows to calibrate ESD chip-level simulation tools and to derive precise I/O library application rules.
UR - http://www.scopus.com/inward/record.url?scp=77950829027&partnerID=8YFLogxK
U2 - 10.1109/EOSESD.2004.5272589
DO - 10.1109/EOSESD.2004.5272589
M3 - Conference contribution
AN - SCOPUS:77950829027
SN - 1585370630
SN - 9781585370634
T3 - Electrical Overstress/Electrostatic Discharge Symposium Proceedings
BT - 2004 Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD '04
T2 - 2004 Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD '04
Y2 - 19 September 2004 through 23 September 2004
ER -