Multi-probe near-field measurement of stochastic noisy radiations: Perspectives for chip-package LNA-probe co-design

Sidina Wane, Damienne Bajon, Dominique Lesénéchal, Johannes A. Russer, David Thomas, Peter Russer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Near-Field scanning systems operating in the Frequency-domain are used for the measurement of radiated emissions from Wireless Chip-to-Chip communication Link. Alternative Time-Domain based Two-Probe Near-Field scanning solutions suitable for stochastic signals and accounting for Field-Field correlations are presented. Chip-Package-PCB Co-Design approach is proposed for high spatial resolution Multi-Probe Near-Field scanning systems with controlled sensitivity and noise uncertainties. Perspectives towards distributed Co-Design of LNA-Probe arrays are drawn for Energy sensing.

Original languageEnglish
Title of host publicationEuropean Microwave Week 2016
Subtitle of host publication"Microwaves Everywhere", EuMW 2016 - Conference Proceedings; 46th European Microwave Conference, EuMC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages548-551
Number of pages4
ISBN (Electronic)9782874870439
DOIs
StatePublished - 2016
Event46th European Microwave Conference, EuMC 2016 - London, United Kingdom
Duration: 4 Oct 20166 Oct 2016

Publication series

NameEuropean Microwave Week 2016: "Microwaves Everywhere", EuMW 2016 - Conference Proceedings; 46th European Microwave Conference, EuMC 2016

Conference

Conference46th European Microwave Conference, EuMC 2016
Country/TerritoryUnited Kingdom
CityLondon
Period4/10/166/10/16

Keywords

  • Chip-to-Chip communication
  • Two-probe near-field measurement

Fingerprint

Dive into the research topics of 'Multi-probe near-field measurement of stochastic noisy radiations: Perspectives for chip-package LNA-probe co-design'. Together they form a unique fingerprint.

Cite this