TY - GEN
T1 - Multi-energy domain modeling of microdevices
T2 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
AU - Wachutka, Gerhard
PY - 2006
Y1 - 2006
N2 - The rapid progress in microsystems technology is increasingly supported by MEMS-specific modeling methodologies and dedicated simulation tools. These do not only enable the visualization of fabrication processes and operational principles, but they also assist the designer in making decisions with a view to finding optimized microstructures under technological and economical constraints. Currently strong efforts are being made towards complete simulation platforms for the predictive simulation of microsystems, i.e. the "virtual fabrication" and "virtual experimentation, characterization and test" on the computer. We discuss the most important aspects to be focussed on and practicable methodologies for microdevice and system modeling, in particular the consistent treatment of coupled fields and coupled domains required for setting up physically-based models for full system mixed-level simulation, and for the reliable validation and accurate calibration of the models.
AB - The rapid progress in microsystems technology is increasingly supported by MEMS-specific modeling methodologies and dedicated simulation tools. These do not only enable the visualization of fabrication processes and operational principles, but they also assist the designer in making decisions with a view to finding optimized microstructures under technological and economical constraints. Currently strong efforts are being made towards complete simulation platforms for the predictive simulation of microsystems, i.e. the "virtual fabrication" and "virtual experimentation, characterization and test" on the computer. We discuss the most important aspects to be focussed on and practicable methodologies for microdevice and system modeling, in particular the consistent treatment of coupled fields and coupled domains required for setting up physically-based models for full system mixed-level simulation, and for the reliable validation and accurate calibration of the models.
UR - http://www.scopus.com/inward/record.url?scp=33847103655&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2006.1644053
DO - 10.1109/ESIME.2006.1644053
M3 - Conference contribution
AN - SCOPUS:33847103655
SN - 1424402751
SN - 9781424402755
T3 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
BT - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Y2 - 24 April 2006 through 26 April 2006
ER -