Modeling of multichip module interconnections by the TLM method and system identification

Keyphrases

• Admittance Matrix 50%
• Computer-aided 50%
• Equivalent Circuit Model 50%
• Impedance Parameters 50%
• Inter-module Connection 100%
• Lumped Equivalent Circuit 100%
• Microwave Circuits 50%
• Multichip Modules 100%
• Multiport 50%
• System Identification 100%
• Three-dimensional (3D) 50%
• TLM Method 100%
• Transmission Line Matrix Methods 50%

Engineering

• Admittance Matrix 50%
• Electric Lines 50%
• Equivalent Circuit 100%
• Equivalent Circuit Model 50%
• Matrix Method 50%
• Microwave Circuit 50%
• Module Interconnection 100%
• Multichip Modules 100%

Physics

• System Identification 100%
• Transmission Line 50%