Mixed-level model for highly perforated torsional actuators coupling the mechanical, the electrostatic and the fluidic domain

We propose a mixed-level simulation scheme for squeeze film damping effects in microdevices, which makes it possible to include damping effects in system-level models of entire microsystems in a natural, physical -based and flexible way. Our approach allows also for complex geometries, large deflection and coupling to other energy domains. In this work we focus on the coupling with the electrostatic field including the effect of a reduced ground electrode size and fringing fields. Using this coupling scheme we are able to simulate the transient switching behavior of a highly perforated electrostatic microrelay at affordable computational expense. For very small air gaps, which occur if the microrelay is closed, the damping model had to be adequately extended. The predictive simulations could be verified by experimental analysis.